Intevac Announces MATRIX Order for Fan-Out Applications in the Advanced Semiconductor Packaging Market
Wed, 24 Mar 2021 00:00:00
“The successful completion of the evaluation program, and subsequent purchase order and customer acceptance of the tool, is important validation that the MATRIX PVD fan-out wafer- and panel-level system meets the requirements for the next-generation advanced semiconductor packaging market,” commented
Semiconductor device packaging technology in general, and fan-out wafer-level packaging (FOWLP) / fan-out panel-level packaging (FOPLP) technology in particular, is being driven by the strong cost advantages these advanced packaging technologies offer over the expense of implementing continued Moore’s Law progress for sub-10nm semiconductor IC process nodes. Fan-out packaging provides for increased I/O (Input/Output) density for a given semiconductor device while simultaneously supporting smaller die sizes, thereby reducing the amount of space integrated circuit content occupies in handheld consumer electronic products, such as smartphones, wearables, and Internet of Things (IoT) devices.
The INTEVAC MATRIX® is a high-productivity, substrate-independent thin-film processing platform that is well-positioned for multiple fan-out packaging applications. The MATRIX Physical Vapor Deposition (PVD) system offers a much-reduced cost of ownership (COO) over the current PVD process tools being used for Redistribution Layer (RDL) barrier/seed layer applications, and also offers the flexibility to run multiple substrates on the same system, from wafer-level (round) substrates to panel-level (square or rectangular) substrates, which today are up to 600mm in size.
In our Thin-film Equipment business, we are a leader in the design and development of high-productivity, thin-film processing systems. Our production-proven platforms are designed for high-volume manufacturing of substrates with precise thin film properties, such as the hard drive media, display cover panel, and solar photovoltaic markets we serve currently.
In our Photonics business, we are a recognized leading developer of advanced high-sensitivity digital sensors, cameras and systems that primarily serve the defense industry. We are the provider of integrated digital imaging systems for most
For more information call 408-986-9888, or visit the Company's website at www.intevac.com.
This press release includes statements that constitute “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Reform Act”).
Chief Financial Officer